CEMWOOD CW020: The extra-fine one.

Dry levelling fill, fill height: 0 – 20 mm

The alternative to hydraulically setting levelling and smoothing compounds: With its optimised, narrow-band grain distribution combined with the specially elongated grain shape of the individual chip, the product is particularly suitable for the traditional area of application of hydraulically setting levelling and smoothing compounds. CW020 is an innovative new development for thin-layer levelling up to 20 millimetres on ceiling panels. CW020 is applied dry and is a quick and inexpensive alternative solution to conventional systems.

For zero levelling areas

Resistant to mould, fungi, rodents

No swelling or shrinkage

Low weight

Quick processing without water

No binders

Can be walked on immediately after application

No waste material

Chip size:  1-2mm
Fire behaviour: Class Bfl-S1
Thermal conductivity: 0.085W/mK
Bulk density: approx. 320kg/m³
Uniform load distribution: 3.2kg per cm
Installation height: 0-20mm
Packaging unit: 50 litres

Applications

Levelling fill on
Concrete ceilings
Screed surfaces
Wooden ceilings